| BGA Replacement and Repair |
DBM Technologies BGA Replacement Process involves the following:
- Bake-out of moisture sensitive components.
- Masking adjacent/secondary side heat sensitive components.
- Custom thermal profile development.
- Monitored removal to profile.
- Pad preparation and mask touch-up if required.
- Addition of solder paste and /or flux.
- Split-beam X, Y, Theta placement.
- Monitored reflow.
- Endoscopic inspection.
- X-ray inspection.
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Detailed Documentation of BGA Rework Performed:
- Printed X-Ray of each reworked BGA and device included with the order.
- Digitally captured BGA X-Ray and BGA endoscopic results available.
- Review of Board layout/land geometry with suggestions for changes if needed.
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DBM Technologies, Inc. uses the following IPC Standards:
- IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies
- IPC-A-610 Acceptability of Electronic Assemblies (Workmanship Standard)
- IPC-A-600 Acceptability of Printed Boards
- IPC TM-650 Test Methods Manual
- IPC-J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
- IPC-J-STD-001GS Space and Military Applications Electronic Hardware Addendum to IPC-J-STD-001G
- Various NASA-STD-8739.X per customer requirements
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